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Application Note
AN008
Wireless Development Kit – User Guide
Overview
EZURiO’s Wireless Development Kit provides a platform for rapid prototyping of wireless
connectivity, providing options for the development of Bluetooth, 802.11 and GPRS
applications
1.
Introduction
The EZURiO Wireless Development Kit is designed to support the rapid development of
applications and software for the EZURiO range of Bluetooth and Wireless LAN modules.
The development board will also allow you to develop applications and services for a
Siemens MC55 GPRS module when connected to an external power supply.
Package Contents
All kits contain the following items
Development
Board
USB cable
Serial cable
Bluetooth USB
adapter
Three Mounting
Spacers
EZURiO terminal
application
Documentation
The mother board is used to mount your chosen wireless module,
providing the RS232 interface and access to all the module
interface pins.
The USB cable can be used as one of the options to provide power
for the dev kit via the onboard connector.
RS232 interface cable to provide the communication between your
host pc and your choice of wireless module. The serial cable can
also be used as an option to power the motherboard and module
from pin 9.
Versions of the Development Kit which include a Bluetooth module
include a FREE USB Bluetooth adaptor and Windows protocols
stack.
Mounting spacers for securing your choice of Bluetooth or Wireless
LAN module to the motherboard
PC based terminal emulation software, specifically designed to help
the development and diagnostics of applications on the EZURiO
range of modules
A development kit user guide, board design circuit diagrams and a
quick start guide
2.
Wireless Module Development Board
The development board allows the EZURiO Bluetooth or Wireless LAN Module to be
connected to a PC. The development board provides RS-232 level conversion through a
standard 9 way D type connector to all pins of the 40 way and a 50 way Hirose
connecters used by Bluetooth or Wireless LAN modules.
APN_06008_1v0 Wireless Development Kit Manual.doc
Page 1
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相关代理商/技术参数
BISM_CONNECTORS # 制造商:Laird Technologies Inc 功能描述:
BISMS02BI 功能描述:蓝牙/802.15.1 模块 BISM II - Bluetooth Surface Mount Mod RoHS:否 制造商:Murata Wireless Solutions 类:1 频带:2402 MHz to 2480 MHz 灵敏度:- 92 dBm 数据速率: 工作电源电压:2.2 V to 3.3 V 输出功率: 接口类型:PCM, UART 天线连接器类型:Chip 最大工作温度:+ 85 C 尺寸:17.5 mm x 16 mm x 2 mm
BISMS02BI # 制造商:Laird Technologies Inc 功能描述:
BISMS02BI-01 制造商:Laird Technologies Inc 功能描述:MODULE BLUETOOTH BISM2 INT ANT 制造商:Laird Technologies Inc 功能描述:BLUETOOTH MODULE SM 制造商:Laird Technologies Inc 功能描述:BLUETOOTH MODULE, BC04, CERAMIC ANT 制造商:Laird Technologies Inc 功能描述:BLUETOOTH MODULE, BC04, CERAMIC ANT; Supply Voltage Min:3.3V; Supply Voltage Max:7V; Signal Range Max:300m; Data Rate:300Kbps; Bluetooth Version:Bluetooth 2.0; Bluetooth Class:Class 1; Receive Sensitivity:-84dB; Operating Temperature;RoHS Compliant: Yes 制造商:Laird Technologies 功能描述:Bluetooth Class I 0.3Mbps 42-Pin SMD
BISMS02BI-01 # 制造商:Laird Technologies Inc 功能描述:
BISMS02BI-NA 功能描述:蓝牙/802.15.1 模块 BISM II - Bluetooth Surface Mount w/U.FL RoHS:否 制造商:Murata Wireless Solutions 类:1 频带:2402 MHz to 2480 MHz 灵敏度:- 92 dBm 数据速率: 工作电源电压:2.2 V to 3.3 V 输出功率: 接口类型:PCM, UART 天线连接器类型:Chip 最大工作温度:+ 85 C 尺寸:17.5 mm x 16 mm x 2 mm
BISMS02BI-NA # 制造商:Laird Technologies Inc 功能描述:
BISPC01BI 制造商:Laird Technologies Inc 功能描述:PC CARD MODULE